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      NXP Semiconductors BYC10-600 Hyperfast power diode BYC10-600 All information provided in this document is subject to legal disclaimers. ? NXP B.V. 2013. All rights reserved Product data sheet 27 May 2013 3 / 9 IF(AV) (A) 0 16 12 4 8 003aak437 16 8 24 32 Ptot (W) 0 0.5 0.2 0.1 δ = 1 Fig. 1. Forward power dissipation as a function of average forward current; square waveform; maximum values IF(AV) (A) 0 10 8 4 6 2 003aak457 10 15 5 20 25 Ptot (W) 0 a = 1.57 1.9 2.2 2.8 4.0 Fig. 2. Forward power dissipation as a function of average forward current; sinusoidal waveform; maximum values 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base Fig. 3 - - 2 K/W Rth(j-a) thermal resistance from junction to ambient free air in free air - 60 - K/W 003aad983 1 10- 1 10 Zth(j-mb) (K/W) 10- 3 - 6 10- 2 tp (s) 10 10 1 10-1 10-5 10-3 10-2 10-4 tp t = p T P t T δ Fig. 3. Transient thermal impedance from junction to mounting base as a function of pulse width |